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MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Features
* * * * * * * * * * * Specified from 50 MHz to 20 GHz Usable up to 26 GHz Low Insertion Loss High Isolation Low Parasitic Capacitance and Inductance RoHS Compliant SurmountTM Package Rugged, Fully Monolithic Glass Encapsulated Construction Up to +38 dBm C.W. Power Handling1 @ +25C Silicon Nitride Passivation Polymer Scratch Protection Rev. V6P
Functional Schematic
J3
Description
MA-COM's MASW-003103-1364 is a SurmountTM broadband monolithic SP3T switch using series and shunt connected silicon PIN diodes. This part is designed for use as a moderate signal, high performance switch in applications up to 20 GHz. This Surface Mount chipscale configuration is optimized for broadband performance with minimal associated parasitics usually associated with hybrid MIC designs incorporating beam lead and PIN diodes that require chip and wire assembly. The MASW-003103-1364 is fabricated using M/ACOM's patented HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance through low millimeter frequencies. Selective backside metalization is applied producing a Surface Mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode airbridge during handling and assembly.
1. 1 Power Handling Testing performed @ 2GHz
J2
J4
J1
Pin Configuration 2
Pin J1 J2 J3 J4 Function RFC RF1 RF2 RF3
2. The exposed pad centered on the chip bottom must be connected to RF and DC ground.
Ordering Information 3
Part Number MASW-003103-13640G MASW-003103-13640P Package GEL PACK POCKET TAPE
3. Reference Application Note M513 for reel size information.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Electrical Specifications: TA = 25C, PIN = 0 dBm, Z0 = 50 , 20mA/-10V
Parameter Insertion Loss Frequency 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz 6 GHz 13 GHz 20 GHz -- -- 2 GHz Units dB Min. -- -- -- 50 37 25 19 14 14 -- -- -- -- -- -- Typ. 0.50 0.8 1.2 54 40 31 25 22 21 57 42 30 20 -- 36 Max. 0.6 1.1 1.4 -- -- -- -- -- -- -- -- -- -- 80 --
Rev. V6P
Isolation
dB
Input Return Loss
dB
Output to Output Isolation Switching Speed4 Voltage Rating5 Input 0.1dB Compression Point
4. 5.
dB ns V dBm
Typical Switching Speed measured fro 10% to 90 % of detected RF signal driven by TTL compatible drivers. Maximum reverse leakage current in either the shunt or series PIN diodes shall be 0.5 uA maximum @ -80 volts.
Functional Schematic J3
Absolute Maximum Ratings 6,7
Parameter Operating Temperature Storage Temperature Junction Temperature Applied Reverse Voltage RF CW Incident Power Absolute Maximum -65 C to +125 C -65 C to +150 C +175 C |-80 V| 38dBm CW @ 2GHz, 25C 33dBm CW @ 20GHz, 25C 50 mA
J2 J4 J1
Bias Current +25C
Max Operating Conditions for combination RF Pwr, DC Bias, & Temp: 33dBm CW @ 20mA per Diode @ 85C
6. 7. Exceeding any one or combination of these limits may cause permanent damage to this device. M/A-COM does not recommend sustained operation near these survivability limits.
Handling Procedures
Please observe the following precautions to avoid damage:
Static Sensitivity
2
These devices are rated at Class 1A Human Body. Proper ESD control techniques should be used when handling these devices.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Typical Performance Curves
In s e rtio n L o s s @ 2 0 m A , -1 0V R F In p u t to R F O u tp u ts (J 1 to J 2 , J3 , J4 ) 0 .0
J1 T O J 2 J1 T O J 3 J1 T O J 4
Rev. V6P
Iso la tio n @ 2 0m A , -1 0 V R F In p u t to R F O u tp u ts (J1 to J 2, J 3, J 4 ) 0
J1 T O J 2 J1 T O J 3 J1 T O J 4
-0 .5
-2 0
Insertion Loss (dB)
-1 .0
Isolation (dB)
-4 0
-1 .5
-6 0
-2 .0 0 5 10 15 20 25 30
-8 0 0 5 10 15 20 25 30
F re q u en c y (G H z )
F re q u en c y (G H z )
In p u t R e tu rn L o s s @ 2 0m A , -1 0 V R F In p u t to R F O u tp u ts (J 1 to J 2 , J3 , J4 ) 0
J1 T O J 2 J1 T O J 3 J1 T O J 4
O u tp u t R e tu rn L o s s @ 2 0 m A , -1 0 V R F In p u t to R F O u tp u ts (J1 to J 2, J 3, J 4 ) 0
J1 T O J 2 J1 T O J 3 J1 T O J 4
Input Return Loss (dB)
-1 0
Output Return Loss (dB)
-1 0
-2 0
-2 0
-3 0
-3 0
-4 0 0 5 10 15 20 25 30
-4 0 0 5 10 15 20 25 30
F re q u en c y (G H z )
F re q u en c y (G H z )
O u tp u t to O u tp u t Is o la tio n @ 2 0 m A , -1 0 V J 2 to J 3 a n d J 3 to J 4 0
J2 T O J 3
MASW -003103-1364 MaximumInput Power Curve Baseplate Temperature fixed @25degC 12 10 Input Power (Watts) 8
2GHz, 5.8W
Output to Output Isolation (dB)
J3 T O J 4
-2 0
-4 0
6 4 2
22GHz, 2W 10GHz, 2.75W
-6 0
-8 0 0 5 10 15 20 25 30
0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
F re q u en c y (G H z )
3
Insertion Loss (dB)
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Bias Control
Optimal operation of the MASW-003103-1364 is achieved by simultaneous application of negative DC voltage and current to the low loss switching arm J2, J3, or J4, and positive DC voltage and current to the remaining switching arms as shown in the applications circuit below. DC return is achieved via R2 on the J1/RF Com Path. In the low loss state, the series diode must be forward biased with current and the shunt diode reverse biased with voltage. In the isolation arms, the shunt diode is forward biased with current and the series diode is reverse biased with voltage. Rev. V6P
Driver Connections
Control Level (DC Currents and Voltages) J2 -10V 8 at -20mA +20mA +20mA J3 +20mA -10V 8 at -20mA +20mA J4 +20mA +20mA -10V at -20mA
8
Condition of Condition of Condition of RF Output RF Output RF Output J1-J2 Low Loss Isolation Isolation J1-J3 Isolation Low Loss Isolation J1-J4 Isolation Isolation Low Loss
8. The voltage applied to the off arm can vary as long as 20mA is applied through the shunt diode on the off arm.
Applications Circuit
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Outline Drawing Footprint
Rev. V6P
Top View
2065 J3
Side View
125 680
Backside View
1960
200 290 200
J3
200
684
1655 J2 J1
680 200 200 200
1540
200
200 200 200
J4
J4
285 200
J2
200 290 200 285
J1
Units in m
Ground radius is 200um centered on the I/O Pad.
MASW-003103-1364 DIM Width Length Thickness Inches MIN 0.06417 0.08031 0.00394 MAX 0.06614 0.08228 0.00591 MIN 1.630 2.040 0.100 mm MAX 1.680 2.090 0.150
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Rev. V6P
Handling Procedures
Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is 1W, conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150C. When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum tip pick-up tool and a force of 60 to100 grams applied to the top surface of the device while placing the chip is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface to minimize stress due to any TCE mismatches that may exist. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , "Surface Mounting Instructions" and can viewed on the MA-COM Technology Solutions website @ www.macomtech.com
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Pocket Tape Information
Rev. V6P
Carrier Tape Dimensions
.157 .004 4.00 0.10 .079 .002 2.00 0.05 .157 .004 4.00 0.10 .059 .004 THRU 1.5
.069 .004 1.75 0.10
+.012 +0.30 8.00 - 0.10 .093 .002 2.36 0.05 0.035 THRU TYP. 0.89
.138 3.5 0.05
.012 .001 0.30 0.03
5 MAX. .012 .002 0.30 0.05 POCKET DEPTH .071 .002 1.80 0.05
Chip Orientation in Tape
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-003103-1364
HMICTM Silicon PIN Diode SP3T Switch 50 MHz - 20 GHz
Reel Information
Rev. V6P
A
DIM A B C D
INCHES MIN. MAX. 6.980 .059 .504 .795 7.019 .098 .520 .815
MM MIN. 177.3 1.5 MAX. 178.3 2.5
12.8
20.2
13.2
20.7
N
W1 W2
2.146
.331 ---
2.185
.337 .567
54.5
8.4 ---
55.5
8.55 14.4
8
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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